INTEL LGA2011 Xeon Thermal Passive, up to 130W Xeon

STS200P Passive Thermal Solution for E5-2600 Processors, Socket 2011, 130W, Aluminum/Copper Boxed Intel® Thermal Solution STS200P (Order Code BXSTS200P): A 25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a TDP of 130W or lower in 1U, or 2U chassis with appropriate ducting.